Top 10 Semiconductor Stocks To Invest In Right Now

Emerging-market stocks advanced, sending the benchmark index to its third straight weekly gain, as China�� economic growth accelerated. Taiwan Semiconductor Manufacturing Co. led technology shares to a record.

The MSCI Emerging Markets Index increased 0.8 percent to 1,042.06, extending its rally for the week to 1.8 percent. A measure of technology shares in developing nations jumped to the highest level since at least 1995 as Taiwan Semiconductor climbed 2.8 percent in Taipei. Benchmark gauges in India and Russia advanced more than 1.3 percent. The Brazilian real led declines among the 31 major currencies tracked by Bloomberg.

Stocks joined a global rally after data showed China�� economic growth accelerated for the first time in three quarters, as Premier Li Keqiang spurred factory output and investment to meet the government�� expansion goal for 2013. Federal Reserve Bank of Chicago President Charles Evans said yesterday the U.S. shouldn�� reduce stimulus after some economic reports stopped during a 16-day government shutdown.

Top 10 Value Companies To Invest In 2015: Universal Display Corp (OLED)

Universal Display Corporation, incorporated on April, 24, 1985, is engaged in the research, development and commercialization of organic light emitting diode (OLED) technologies and materials for use in flat panel display, solid state lighting and other product applications. The Company�� primary business strategy is to develop and license its OLED technologies to product manufacturers for use in these applications. Its primary business is to develop and license its OLED technologies to manufacturers of products for display applications, such as cell phones, portable media devices, tablets, laptop computers and televisions, and specialty and general lighting products; and develop new OLED materials and sell the materials to those product manufacturers. The Company sells its OLED materials to customers for evaluation and use in commercial OLED products. As of December 31, 2012, the Company owns, exclusively license or have the sole right to sublicense more than 3,000 patents issued and pending worldwide. On July 23, 2012, the Company entered into a Patent Sale Agreement (the Agreement) with FUJIFILM. Under the Agreement, FUJIFILM sold more than 1,200 OLED related patents and patent applications.

Phosphorescent Organic Light Emitting Diode Technologies

Phosphorescent OLEDs utilize specialized materials and device structures that allow OLEDs to emit light through a process known as phosphorescence. Traditional fluorescent OLEDs emit light through an inherently less efficient process. Theory and experiment show that phosphorescent OLEDs exhibit device efficiencies up to four times higher than those exhibited by fluorescent OLEDs. Phosphorescence substantially reduces the power requirements of an OLED and is potentially useful in displays for hand-held devices, such as Smartphone��, where battery power is often a limiting factor. Phosphorescence is also important for area displays such as televisions, where higher device efficiency and lower heat generation may enable longer ! product lifetimes and increased energy efficiency.

Additional Proprietary Organic Light Emitting Diode Technologies

Additional OLED Technologies include FOLED Flexible OLEDs, Thin-Film Encapsulation, UniversalP2OLED Printable Phosphorescent OLEDs, OVJP Organic Vapor Jet Printing, OVPD Organic Vapor Phase Deposition and TOLED Transparent OLEDs. The Company is working on a number of technologies required for the fabrication of OLEDs on flexible substrates. As of December 31, 2012, it was conducting research and development on FOLED technologies internally, under several of its United States government programs and in connection with the government-sponsored Flexible Display Center at Arizona State University (ASU). The Company announced its, patented encapsulation technology for the packaging of flexible OLEDs and other thin-film devices, as well as for use as a barrier film for plastic substrates. Its approach for manufacturing a small molecule OLED, including a PHOLED, is based on a vacuum thermal evaporation (VTE) process.

The Company has partnered with Aixtron AG, which is a manufacturer of metal-organic chemical vapor deposition equipment, to develop and qualify equipment for the fabrication of OLED displays utilizing the OVPD process. It has developed a technology for the fabrication of OLEDs that have transparent cathodes. TOLEDs use a transparent cathode and either a transparent, reflective or opaque metal anode.

Organic Light Emitting Diode Materials Supply Business

The Company supplies its proprietary UniversalPHOLED materials to display manufacturers and others. The Company qualifies its materials in OLED devices before shipment in order to ensure that they meet required specifications. During 2012, the Company continued supplying its proprietary UniversalPHOLED materials to SDC for use in its commercial AMOLED display products and for its development efforts. During 2012, the Company also supplied its UniversalPHOLED materials to! LG Displ! ay for use in its commercial AMOLED display products, to Tohoku Pioneer for use in its commercial PMOLED display products, and Konica Minolta for its manufacture of commercial OLED lighting products. During 2012, the Company also supplied its proprietary OLED materials to these and various other product manufacturers for evaluation and for purposes of development, manufacturing qualification and product testing.

The Company competes with Eastman Kodak Company (Kodak), Cambridge Display Technology, Ltd. (CDT), Sumitomo Chemical Company (Sumitomo), Idemitsu Kosan Co., Ltd. (Idemitsu Kosan), Merck KGaA and BASF Corporation.

Advisors' Opinion:

• [By Jake L'Ecuyer]

  Shares of Universal Display (NASDAQ: OLED) got a boost, shooting up 24.36 percent to $36.25 after the company reported upbeat Q3 results and issued a strong FY13 revenue forecast.

• [By John Udovich]

  As for potential peer comparisons on the OLED and liquid crystal display side, small cap Daktronics is a�designer and manufacturer electronic scoreboards, programmable display systems and large screen video displays;�the SGOCO Group Ltd is focused on product design and brand development in the Chinese flat panel display market; and Universal Display Corporation is a�world leader in the development of innovative organic light-emitting diode (OLED) technology for use in flat panel displays, lighting and organic electronics. So its not a perfect peer comparison but all of these stocks would be on the cutting edge of glass, how glass is used or glass display technology. So we don�� know how big of a potential�negative.

• [By Chris Hill]

  We closed today's show with two stocks to watch. Motley Fool analyst Jason Moser has Air Methods (NASDAQ: AIRM  ) on his radar. And analyst Matt Argersinger is watching Universal Display (NASDAQ: OLED  ) .

• [By Evan Niu, CFA]

  Cook also noted certain weaknesses such as color saturation and brightness with OLED displays back in February at a Goldman Sachs conference, which sent shares of Universal Display (NASDAQ: OLED  ) reeling briefly before the OLED specialist recovered. That was likely a knock directed more in Samsung's direction, since the South Korean company is the biggest proponent of OLED displays in mobile devices, but Samsung is also Universal Display's biggest customer. Universal Display simply got caught in the crossfire.

Top 10 Semiconductor Stocks To Invest In Right Now: Celestica Inc (CLS)

Celestica Inc. (Celestica), incorporated on September 27, 1996, is a provider of supply chain solutions globally to original equipment manufacturers (OEMs) and service providers in the communications, consumer, computing and diversified end markets. The Company has operating network in Americas, Asia and Europe. The products and services it provides serve a range of end products, including smartphones; servers; networking, wireless and telecommunications equipment; storage devices; aerospace and defense electronics, such as in-flight entertainment and guidance systems; healthcare products; audiovisual equipment; printer supplies; peripherals; semiconductor capital equipment, and a range of industrial and green technology electronic equipment, including solar panels and inverters. In June 2011, Celestica acquired the semiconductor equipment contract manufacturing operations of Brooks Automation, Inc. In September 2012, the Company acquired D&H Manufacturing Company. D&H is a manufacturer of precision machined components and assemblies, primarily for the semiconductor capital equipment market.

Celestica offers a range of services, including design, manufacturing, engineering, order fulfillment, logistics and after-market services. The Company uses enterprise resource planning and supply chain management systems to optimize materials management from suppliers through to its customers.

Its global design services and solutions architects are focused on opportunities that span the entire product lifecycle. It also leverages its CoreSim Technology to minimize design revisions. It has developed its Green Services to help its customers comply with environmental legislation, such as those relating to the removal of hazardous substances and waste management/recycling. Its services help the customers design, prototype, introduce, manufacture, test, ship, takeback, repair, refurbish, reuse, recycle and properly dispose of end-of-life (EOL) products. Prototyping is a critical early-stage p! rocess in the development of new products. It uses technologies in the assembly and testing of the products. Its failure analysis capabilities concentrate on identifying the root cause of product failures and determining corrective actions. It has a management system that focuses on continual process improvement.

The Company competes with Benchmark Electronics, Inc., Flextronics International Ltd., Hon Hai Precision Industry Co., Ltd., Jabil Circuit, Inc., Plexus Corp. and Sanmina-SCI Corporation.

Advisors' Opinion:

• [By Seth Jayson]

  Celestica (NYSE: CLS  ) reported earnings on April 23. Here are the numbers you need to know.

  The 10-second takeaway
  For the quarter ended March 31 (Q1), Celestica met expectations on revenues and beat expectations on earnings per share.

Top 10 Semiconductor Stocks To Invest In Right Now: Advanced Semiconductor Engineering Inc (ASX)

Advanced Semiconductor Engineering, Inc. is principally engaged in the manufacture, assembly, processing, testing and distribution of integrated circuits (ICs). The Company provides semiconductor packaging and testing services, including plastic leaded chip carriers (PLCCs), quad flat packages (QFPs) and flip chip packaging technology, among others, which are applied in the manufacture of household electrical appliances, communication devices, automobile components, personal computers, set top boxes, servers, memory integrated circuits (ICs), mobile phones, digital cameras, game consoles, projectors, high definition (HD) televisions, wireless communication network products and power management ICs, among others. The Company operates its businesses primarily in Taiwan, Europe and the Americas. In August 2010, the Company acquired a 100% interest in EEMS Test Singapore.

The Company is focused on packaging and testing logic semiconductors. The Company offers its customers turnkey services, which consist of packaging, testing and direct shipment of semiconductors to end users designated by its customers. The Company�� global base of over 200 customers includes semiconductor companies across a range of end use applications, including Altera Corporation, ATI Technologies, Inc., Broadcom Corporation, Cambridge Silicon Radio Limited and Microsoft Corporation. During the year ended December 31, 2008, the Company�� packaging revenues accounted for 77.7% of its net revenues and its testing revenues accounted for 20.1% of its net revenues.

Packaging Services

The Company offers a range of package types to meet the requirements of its customers, with a focus on packaging solutions. Within its portfolio of package types, the Company focuses on the packaging of semiconductors. These include advanced leadframe-based package types, such as quad flat package, thin quad flat package, bump chip carrier and quad flat no-lead package, and package types based on substrates, such a! s flip-chip ball grid array (BGA) and other BGA types, as well as other packages, such as wafer-bumping products. Leadframe-based packages are packaged by connecting the die, using wire bonders, to the leadframe with gold wire. The Company�� leadframe-based packages include quad flat package (QFP)/ thin quad flat package (TQFP), quad flat no-lead package (QFN)/microchip carrier (MCC), advanced quad flat no-lead package (AQFN), bump chip carrier (BCC), small outline plastic package (SOP)/thin small outline plastic package (TSOP), small outline plastic j-bend package (SOJ), plastic leaded chip carrier (PLCC) and plastic dual in-line package (PDIP). Substrate-based packages employ the BGA design, which utilizes a substrate rather than a leadframe. It also assembles system-in-a-package products, which involve the integration of more than one chip into the same package. The Company�� substrate-based packages include Plastic BGA, Cavity Down BGA, Stacked-Die BGA, Flip-Chip BGA and land grid array (LGA).

The Company�� wafer-level packaging products include wafer level chip scale package (aCSP) and advanced wafer level package (aWLP). The Company offers module assembly services, which combine one or more packaged semiconductors with other components in an integrated module to enable functionality, typically using surface mount technology (SMT) machines and other machinery and equipment for system-level assembly. End use applications for modules include cellular phones, personal digital assistant (PDAs), wireless local area network (LAN) applications, bluetooth applications, camera modules, automotive applications and toys.

The Company provides module assembly services primarily at its facilities in Korea for radio frequency and power amplifier modules used in wireless communications and automotive applications. Interconnect materials connect the input/output on the semiconductor dies to the printed circuit board. Interconnect materials include substrate, which is a multi-layer m! iniature ! printed circuit board. The Company produces substrates for use in its packaging operations.

Testing Services

The Company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, final testing of logic/mixed-signal/radio frequency (RF) and memory semiconductors and other test-related services. The Company provides front-end engineering testing services, including customized software development, electrical design validation, and reliability and failure analysis. The Company provides final testing services for a variety of memory products, such as static random access memory (SRAM), dynamic random access memory (DRAM), single-bit erasable programmable read-only memory semiconductors and flash memory semiconductors.

The Company provides a range of additional test-related services, including burn-in testing, module sip testing, dry pack, tape and reel, and electric interface board and mechanical test tool design. The Company offers drop shipment services for shipment of semiconductors directly to end users designated by its customers.

Advisors' Opinion:

• [By David Dittman]

  Crown Resorts is a buy all the way up to USD16.50 on the Australian Securities Exchange (ASX) using the symbol CWN and on the US over-the-counter (OTC) market using the symbol CWLDF.

• [By Seth Jayson]

  Advanced Semiconductor Engineering (NYSE: ASX  ) is expected to report Q2 earnings around July 7. Here's what Wall Street wants to see:

• [By Jeff Reeves]

  Next Page

  Best Stocks to Buy for Around $5: Advanced Semiconductor Engineering (ASX)

  Advanced Semiconductor Engineering�(ASX) builds and distributes integrated circuits and other electronics. While that�� not as sexy as other chipmakers that play to mobile, it�� still a good business, considering the general demand for microchips in everything from cars to computers to TVs.

Top 10 Semiconductor Stocks To Invest In Right Now: Fairchild Semiconductor International Inc (FCS)

Fairchild Semiconductor International, Inc. (Fairchild) focuses on developing, manufacturing and selling power analog, power discrete and certain non-power semiconductor solutions to a range of end market customers. The Company is a supplier of power analog products, power discrete products and energy-efficient solutions, according to iSuppli. Its products are used in a range of electronic applications, including sophisticated computers and Internet hardware; communications, including wireless phones; networking and storage equipment; industrial power supply and instrumentation equipment; consumer electronics, such as digital cameras, displays, audio/video devices and household appliances, and automotive applications.

The Company�� product groups are organized by the end markets, which include Mobile, Computing, Consumer and Communication (MCCC), Power Conversion, Industrial and Automotive (PCIA) and Standard Discrete and Standard Linear (SDT). It invested in the wafer fabrication power semiconductor technology, including low and mid voltage PowerTrench, advanced insulated gate bipolar transistor (IGBT), as well as advanced high power metal oxide semiconductor field effect transistors (MOSFET) fabrication technologies.

Mobile, Computing, Consumer and Communication (MCCC)

The Company designs, manufactures and markets high-performance analog and mixed signal integrated circuits, low voltage power MOSFETs for mobile, consumer, computing, and communication applications. It has a portfolio of PowerTrench technology products. Its analog and mixed signal products are focused on the mobile end- markets.

Analog products monitor, interpret, and control continuously variable functions, such as light, color, sound, and energy. It forms the interface with the digital world. It provides a range of analog products that perform such tasks as voltage regulation, audio amplification, power and signal switching and system management. Analog voltage regulation circ! uits are used to provide constant voltages, as well as step up or step down voltage levels on a circuit board. These products enable improvements in power efficiency, lighting management, and improve charge times in ultraportable products. These products are used in a variety of mobile, computing, communications and consumer applications.

In addition to the power analog and interface products, it also offers signal path products. These include analog and digital switches, universal serial bus (USB) switches, video filters and high performance audio amplifiers. The analog switch functions are typically found in cellular handsets and other ultra portable applications. The video products provide a single chip solution to video filtering and amplification. Video filtering applications include set top boxes and digital television. Its solutions include surface mount devices, tiny packages, chip scale packages, and leadless carriers.

The Company also design, manufacture and market power semiconductor solutions for computing, communications, mobile, consumer and industrial applications. Power semiconductor solutions include, power discrete MOSFETs, analog integrated circuits, and fully integrated multi-chip and monolithic power solutions. Its power MOSFETs are primarily used in power delivery and power control applications. Power delivery and control applications are ubiquitous across data consumption, processing and communication applications. It produces advanced low power MOSFETs under its PowerTrench brands. The advanced power MOSFETs applications are used in smartphones, tablets, notebook personal computer, high performance gaming, home entertainment systems, servers, data communication, and routers.

The Company competes with Analog Devices, Inc., Linear Technology Corporation, Maxim Integrated Product, Inc., Micrel Inc, ON Semiconductor Corporation, ST Microelectronics N.V., Intersil Corporation, International Rectifier Corporation, Infineon Technologies AG and T! exas Inst! ruments Incorporated.

Power Conversion, Industrial and Automotive (PCIA)

Fairchild design, manufacture and market power discrete semiconductors, analog and mixed signal integrated circuits (ICs) for broad power conversion/power management, industrial, and automotive applications. Its products are building blocks that help convert a semi-regulated energy source (alternating current (AC)or direct current (DC)) to a regulated output for electronic systems (AC-DC, DC-AC, and DC-DC conversion). Its discrete devices are individual diodes or transistors that perform power switching, power conditioning and signal amplification functions in electronic circuits. The Company�� analog and mixed signal integrated circuits (IC) are used to control discrete semiconductors in applications, such as power switching, conditioning, signal amplification, power distribution and power consumption. It manufacture discrete products using vertical DMOS MOSFETs, Insulated Gate Bipolar Transistors (IGBT), Bipolar, and ultrafast rectifier technologies. It manufacture analog and mixed signal ICs using a range of bipolar (Bi), complementary metal oxide (CMOS), BiCMOS, and bipolar/CMOS/DMOS (BCDMOS) processes up to 1,200 volts and down to 0.35um (microns) minimum geometry.

Power MOSFETs are used in applications to switch, shape or transfer energy. These products are used in a range of high-growth applications, including solar inverters, uninterruptible power supplies (UPS), data centers and communications, motors, lighting, automotive, computing, displays and industrial supplies. It produce advanced power MOSFETs under its SupreMOS, SuperFET, PowerTrench, UniFET and QFET brands. IGBTs are high-voltage power discrete devices. They are used in switching applications for solar inverters, uninterruped power supply, data centers and communications, motors, industrial, power supplies, displays, television and automotive ignition systems. These applications require lower switching frequencies, highe! r power, ! and/or higher voltages than a power MOSFET can provide. It is a supplier of IGBTs. Rectifier products work with IGBTs and MOSFETs in many applications to provide power conversion and conditioning. Its product is the STEALTH rectifier, providing industry performance and efficiencies in data communications, industrial power supply, displays, television, and motor applications.

Leveraging its power MOSFET and IGBT technologies, it also design and manufacture modules for the industrial, automotive, and home appliance end markets. It design and develop a line of smart power modules (SPM) products targeted to various end applications in consumer white goods and industrial applications, which include room air conditioners, industrial power supplies, solar inverters, pumps, and industrial motors. These are multi-chip modules containing up to 28 components in a single package that includes diodes, power discrete IGBTs or MOSFETs, high voltage power management driver ICs and current and temperature sensors. Similar modules, called APM, are used in automotive applications.

The Company design and manufacture power management semiconductors for line-powered and off-line powered systems that integrate its Power MOSFETs. It sell and market off-line and isolated DC-DC ICs, MOSFET and IGBT gate driver ICs, and power factor correction ICs to the consumer, computing, display, television, lighting and industrial segments.

The Company competes with Infineon Technologies AG, ST MicroelectronicsN.V., International Rectifier Corporation, Toshiba Corporation, Mitsubishi Corporation, Texas Instruments Incorporated, Power Integrations, Inc., ON Semiconductor Corporation, NXP Semiconductors N.V. and Vishay Intertechnology, Inc.

Standard Linear and Standard Discrete (SDT)

Standard Diodes and Transistors products cover a range of semiconductor products, including MOSFET, junction field effect transistors (JFETs), high power bipolar, discrete small signal transistors, TVS,! Zeners, ! rectifiers, bridge rectifiers, Schottky devices and diodes. The Company design, manufacture and market analog integrated circuits for computing, consumer, communications, ultra-portable and industrial applications. These products are manufactured using bipolar, CMOS and BiCMOS technologies. Standard Linear solutions range from bipolar regulators, shunt regulators, low drop out regulators, standard op-amp/comparators, low voltage op-amps, and others. Analog voltage regulator circuits are used to provide constant voltages, as well as to step up or step down voltage levels on a circuit board. Op-amps/comparators are designed specifically to operate from a single power supply over a range of voltages. It also offer low-voltage op-amps that provide a combination of low power, rail-to-rail performance, low voltage operation, and tiny package options which are well suited for use in personal electronics equipment. Its solutions include surface mount devices, tiny packages and leadless carriers.

The Company competes with International Rectifier Corporation, Diodes Incorporated, NXP Semiconductors N.V., ST Microelectronics N.V., ON Semiconductor Corporation, Texas Instruments Incorporated, Vishay Intertechnology, Inc., Vishay Intertechnology, Inc, Osram Opto Semiconductors, OPTEK Technology, OMRON Corporation, Avago Technologies Ltd. and Kodenshi Corp.

Advisors' Opinion:

• [By Seth Jayson]

  Fairchild Semiconductor International (NYSE: FCS  ) reported earnings on April 18. Here are the numbers you need to know.

  The 10-second takeaway
  For the quarter ended March 31 (Q1), Fairchild Semiconductor International met expectations on revenues and missed expectations on earnings per share.

Top 10 Semiconductor Stocks To Invest In Right Now: Ambarella Inc (AMBA)

Ambarella, Inc., incorporated on January 15, 2004, is a developer of semiconductor processing solutions for video that enable high-definition (HD), video capture, sharing and display. The Company combine its processor design capabilities with its video and image processing, algorithms and software to provide a technology platform. It sells solutions into the camera and infrastructure markets, with approximately 27 million system-on-a-chips (SoCs) shipped since our inception. In the camera market, its solutions enable the creation of video content for wearable sports cameras, automotive aftermarket cameras, Internet Protocol (IP), security cameras, digital still cameras (DSCs), telepresence cameras, camcorders and pocket video cameras. In the infrastructure market, its solutions manage IP video traffic, broadcast encoding and IP video delivery applications. In 2012, the Company released its Wireless Camera Developers Kit. In 2012, it also launched S2 SoC, which enables Ultra High-Definition IP security cameras.

The Company sells its solutions to original design manufacturers (ODMs), and original equipment manufacturers (OEMs), globally. In the camera market, its video processing solutions are designed into products from OEMs, including Robert Bosch GmbH and affiliated entities, Samsung Electronics Co., Ltd. and Woodman Labs, Inc., doing business as (d/b/a) GoPro, or GoPro, who source its solutions from ODMs, including Ability Enterprise Co., Ltd., Asia Optical Co. Inc., Chicony Electronics Co., Ltd., DXG Technology Corp., Hon Hai Precision Industry Co., Ltd. and Sky Light Digital Ltd. In the infrastructure market, its solutions are designed into products from OEMs, including Harmonic Inc., Motorola Mobility, Inc. (owned by Google, Inc.) and Telefonaktiebolaget LM Ericsson, who source its solutions from ODMs, such as Plexus Corp.

AmbaClear

The Company�� image signal processing architecture, known as AmbaClear, incorporates advanced algorithms to convert raw senso! r data to high-resolution still and high-definition video images concurrently. Image processing algorithms include sensor, lens and color correction, demosaicing, which is a process used to reconstruct a full color image from incomplete color samples, noise filtering, detail enhancement and image format conversion.

AmbaCast

The Company�� HD video processing architecture, known as AmbaCast, incorporates advanced algorithms for motion estimation, motion-compensated temporal filtering, mode decision and rate control. It supports all three compression profilesbaseline, main and highas specified in the H.264 standard. Its solutions for the broadcast infrastructure market allow OEMs to offer both the H.264 and MPEG-2 encoding formats.

Design Methodology

The Company test and verify its algorithms on its architectural model prior to implementing algorithms in hardware. Its advanced verification methodology validates its approach through simultaneous modeling of architecture, algorithms and the hardware itself.

SoC Solution

The Company�� SoC designs integrate HD video processing, image processing, applications processing and system functions onto a single chip, delivering video and image quality with features, including advanced wireless connectivity. In addition, its SoCs integrate mixed signal (analog/digital) functionality and high speed interfaces required for interfacing to advanced high-speed CMOS sensors and industry standard interfaces, such as USB 2.0 and HDMI 1.4. Its A7L SoC, which it introduced in September 2011, is fabricated in edge 32 nanometer (nm) process technology and integrates AmbaClear and AmbaCast technology.

Software Development Kit for Connectivity

The Company�� video streaming technology enables the camera�� image to be previewed on a smartphone. To enable this functionality, end customers deploy its Wireless Camera Developer�� Kit, or the Kit, which enables the design of ca! meras tha! t combine still photography and Full HD video with wireless video streaming to smartphones. The Kit is available for its A7L SoC product family, providing full 1080p60 HD video with photography and low power consumption.

The Company competes with CSR Plc, Fujitsu Limited, HiSilicon Technologies Co., Ltd., Texas Instruments Incorporated, Canon Inc., Panasonic Corporation, Sony Corporation, Novatek Microelectronics Corp., Sunplus Technology Co. Ltd., Intel Corporation, Magnum Semiconductor, Inc., Texas Instruments Incorporated, Broadcom Corporation, NVIDIA Corporation, Qualcomm Incorporated and Samsung.

Advisors' Opinion:

• [By Rich Smith]

  Ambarella just crashed
  Following a Street.com report detailing insider selling at Ambarella (NASDAQ: AMBA  ) earlier this week, and a downgrade of the stock to hold by Needham & Co. earlier this morning, shares of the high-def "system-on-a-chip" semiconductor maker are plunging, down nearly 8% at last report. Should investors be worried?

Top 10 Semiconductor Stocks To Invest In Right Now: Xilinx Inc (XLNX)

Xilinx, Inc. (Xilinx), incorporated on February 5, 1984, designs, develops and markets programmable platforms. These programmable platforms have a number of components, including integrated circuits (ICs) in the form of programmable logic devices (PLDs), including Extensible Processing Platforms (EPPs); software design tools to program the PLDs; targeted reference designs; printed circuit boards, and intellectual property (IP), which consists of Xilinx and various third-party verification and IP cores. In addition to its programmable platforms, Xilinx provides design services, customer training, field engineering and technical support. The Company�� PLDs include field programmable gate arrays (FPGAs), complex programmable logic devices (CPLDs) that its customers program to perform logic functions, and EPPs. Xilinx�� products are offered to electronic equipment manufacturers in end markets, such as wired and wireless communications, industrial, scientific and medical, aerospace and defense, audio, video and broadcast, consumer, automotive and data processing. The Company sells its products globally through independent domestic and foreign distributors and through direct sales to original equipment manufacturers (OEMs) by a network of independent sales representative firms and by a direct sales management organization. In January 2011, the Company acquired AutoESL Design Technologies, Inc. In August 2012, the Company acquired embedded Linux solutions provider PetaLogix.

Product Families

The 7 series devices that comprise the Company�� 28-nanometer (nm) product families are fabricated on a high-K metal gate 28-nm process technology. These devices are based on an architecture, which enables design and IP portability and re-use across all families, as well as provides designers the ability to achieve the appropriate combination of I/O support, performance, feature quantities, packaging and power consumption to address a range of applications. The 7 series devices consist of! three families: Virtex-7 FPGA, Kintex-7 FPGAs and Artix-7 FPGAs. The Zynq-7000 family is the family of Xilinx EPPs. The Virtex-6 FPGA family consists of 13 devices and is the sixth generation in the Virtex series of FPGAs.

Virtex-6 FPGAs are fabricated on a high-performance, 40-nm process technology. There are three Virtex-6 families: Virtex-6 LXT FPGAs, Virtex-6 SXT FPGAs and Virtex-6 HXT FPGAs. The Spartan-6 family is the PLD industry�� 45-nm high-volume FPGA family, consisting of 11 devices in two product families: Spartan-6 LX FPGAs and Spartan-6 LXT FPGAs. The Virtex-5 FPGA family consists of 26 devices in five product families: Virtex-5 LX FPGAs for logic-intensive designs, Virtex-5 LXT FPGAs for high-performance logic with serial connectivity, Virtex-5 SXT FPGAs for high-performance DSP with serial connectivity, Virtex-5 FXT FPGAs for embedded processing with serial connectivity and Virtex-5 TXT FPGAs for high-bandwidth serial connectivity. Prior generation Virtex families include Virtex-4, Virtex-II Pro, Virtex-II, Virtex-E and the original Virtex family. Spartan family FPGAs include 90-nm Spartan-3 FPGAs, the Spartan-3E family and the Spartan-3A family. Prior generation Spartan families include Spartan-IIE, Spartan-II, Spartan XL and the original Spartan family.

Design Platforms and Services

The Company offers three types of programmable platforms. The Base Platform is the delivery vehicle for all of its new silicon offerings used to develop and run customer-specific software applications and hardware designs. The Base Platform consists of FPGA silicon; Integrated Software Environment (ISE) Design Suite design environment; integration support of optional third-party synthesis, simulation, and signal integrity tools; reference designs; development boards and IP. The Domain-Specific Platform targets one of the three primary Xilinx FPGA user profiles: the embedded processing developer; the DSP developer; or the logic/connectivity developer. The Market-S! pecific P! latform enables software or hardware developers to build and run their specific application or solution. Built for specific markets, such as automotive, consumer, aerospace and defense, communications, audio, video and broadcast, industrial, or scientific and medical, the Market-Specific Platform integrates both the Base and Domain-Specific Platforms.

During April 2012, Xilinx introduced the Vivado Design Suite. Vivado supports Xilinx 7 series FPGAs and Zynq EPPs. Xilinx and various third parties offer hundreds of no charge and fee-bearing IP core licenses covering Ethernet, memory controllers Interlaken and PCIe interface, as well as domain-specific IP in the areas of embedded, DSP and connectivity, and market-specific IP cores. The Company also offers development kits, including hardware, design tools, IP and reference designs. Xilinx offers a range of configuration products, including one-time programmable and in-system programmable storage devices to configure Xilinx FPGAs. These programmable read-only memory (PROM) products support all of the Company�� FPGA devices. Xilinx and certain third parties have developed and offer a ecosystem of IP, boards, tools, services and support through the Xilinx alliance program. Xilinx also works with these third parties to promote its programmable platforms through third-party tools, IP, software, boards and design services. Xilinx engineering services provide customers with engineering, ranging from hands-on training to full design creation and implementation.

The Company competes with Altera Corporation, Lattice Semiconductor Corporation and Microsemi Corporation.

Advisors' Opinion:

• [By Michael Flannelly]

  Programmable logic solutions provider Xilinx, Inc. (XLNX) was upgraded by analysts at Pacific Crest early on Monday, as the company should benefit from the LTE upgrade in China.

  The analysts upgraded XLNX from “Sector Perform” to “Outperform” and see shares reaching $55. This price target suggests an 18% upside to the stock’s Friday closing price of $46.54.

  Xilinx shares were inactive during pre-market trading on Monday. The stock is up 29.78% year-to-date.

Top 10 Semiconductor Stocks To Invest In Right Now: NextStage Inc (NXT)

NextStage, Inc. is a holding company. The Company is engaged in the management of its investments in shares of stocks of its subsidiaries. The Company�� subsidiaries include Mondex Philippines Inc. (MXP), Infinit-e Asia Inc. (Infinit-e Asia) and Technology Support Services, Inc. (TSSI). MXP operates a multi-application smart card system in Philippines. Infinit-e Asia is a software development company specializing on smart card and e-commerce solutions tailored to enhance the business of its clients. Infinit-e Asia develops smart card solutions for both real and online applications and on both contact and contactless platform. Infinit-e Asia�� spectrum of products and applications are classified as payments, data capture and security. TSSI is engaged in the business of business process outsourcing (BPO), applications service providers (ASP) and managed service providers (MSP). Advisors' Opinion:

• [By Namitha Jagadeesh]

  HSBC Holdings Plc (HSBA), Europe�� largest bank, slid 2.1 percent. International Consolidated Airlines Group SA (IAG) declined 2 percent as it canceled some of its flights following a disruption caused by one of its planes at Heathrow airport. Next Plc (NXT) retreated 2.4 percent as Morgan Stanley cut its recommendation on the shares.